Patent Assignment
Reel/Frame 056245/0530
Assignment of Assignor's Interest
Recorded: 2021-05-14
Pages: 4
Assignors
YEH, SHU-SHEN
Executed: 2021-05-12
LIN, PO-YAO
Executed: 2021-05-12
WANG, CHIN-HUA
Executed: 2021-05-12
LIN, YU-SHENG
Executed: 2021-05-12
JENG, SHIN-PUU
Executed: 2021-05-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and Method for Forming the Same