Patent Assignment
Reel/Frame 056252/0306
Assignment of Assignor's Interest
Recorded: 2021-05-14
Pages: 4
Assignors
KOAI, KEITH KUANG-KUO
Executed: 2020-06-24
LIU, SHIH-KUO
Executed: 2021-04-22
WANG, WEN-CHIH
Executed: 2020-06-17
CHEN, HSIN-LIANG
Executed: 2021-03-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Apparatus for Fabricating a Semiconductor Structure and Method of Fabricating a Semiconductor Structure