Patent Assignment
Reel/Frame 056259/0290
Assignment of Assignor's Interest
Recorded: 2021-05-17
Pages: 6
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bump Bonding Structure to Mitigate Space Contamination for Iii-V Dies and Cmos Dies