Patent Assignment
Reel/Frame 056262/0309
Assignment of Assignor's Interest
Recorded: 2021-05-17
Pages: 4
Assignors
LIN, MENG-HAN
Executed: 2021-05-13
YANG, FENG-CHENG
Executed: 2021-05-16
WANG, SHENG-CHEN
Executed: 2021-05-13
YEONG, SAI-HOOI
Executed: 2021-05-16
LIN, YU-MING
Executed: 2021-05-13
CHIA, HAN-JONG
Executed: 2021-05-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
3D Memory Array Contact Structures