Patent Assignment
Reel/Frame 056279/0166
Assignment of Assignor's Interest
Recorded: 2021-05-18
Pages: 8
Assignors
SUN, YANGYANG
Executed: 2021-04-06
WENG, LI-SHENG
Executed: 2021-04-06
SONG, ZHIMIN
Executed: 2021-05-05
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Package Comprising a Substrate and a High-Density Interconnect Integrated Device