IP Library › Assignment 056302/0589
Patent Assignment
Reel/Frame 056302/0589

Assignment of Assignor's Interest

Recorded: 2021-05-20 Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2021-05-20
CHEN, YING-JU
Executed: 2021-05-17
CHEN, MING-FA
Executed: 2021-05-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Bonding to Alignment marks with Dummy Alignment Marks
Application: 17/325,667 →
Publication: US 2022/0310554