Patent Assignment
Reel/Frame 056310/0242
Assignment of Assignor's Interest
Recorded: 2021-05-21
Pages: 6
Assignors
CHANEMOUGAME, DANIEL
Executed: 2021-05-19
LIEBMANN, LARS
Executed: 2021-05-19
SMITH, JEFFREY
Executed: 2021-05-19
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Connections from Buried Interconnects to Device Terminals in Multiple Stacked Devices Structures