Patent Assignment
Reel/Frame 056314/0843
Assignment of Assignor's Interest
Recorded: 2021-05-21
Pages: 4
Assignors
YANG, TING-LI
Executed: 2021-05-21
TSAI, PO-HAO
Executed: 2021-05-16
WU, YI-WEN
Executed: 2021-05-16
YANG, SHENG-PIN
Executed: 2021-05-16
LIU, HAO-CHUN
Executed: 2021-05-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Micro-Bump Integration with Redistribution Layer