Patent Assignment
Reel/Frame 056322/0120
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 3
Assignors
WANG, PU
Executed: 2020-10-16
CHENG, LI-HUI
Executed: 2020-10-16
LU, SZU-WEI
Executed: 2020-10-16
TSOU, HSIEN-JU
Executed: 2020-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same