Patent Assignment
Reel/Frame 056325/0231
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 7
Assignors
LEE, MINGU
Executed: 2021-04-02
PARK, CHULHYUN
Executed: 2021-04-02
LEE, KANGSAN
Executed: 2021-04-02
LEE, EUNHAENG
Executed: 2021-04-02
CHOI, EUISUN
Executed: 2021-04-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Manufacturing Apparatus Including Bonding Head