Patent Assignment
Reel/Frame 056330/0396
Assignment of Assignor's Interest
Recorded: 2021-05-24
Pages: 11
Assignors
LIEBMANN, LARS
Executed: 2021-05-07
SMITH, JEFFREY
Executed: 2021-05-21
CHANEMOUGAME, DANIEL
Executed: 2021-05-07
GUTWIN, PAUL
Executed: 2021-05-12
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Inter-Level Handshake for Dense 3D Logic Integration