IP Library Assignment 056332/0061
Patent Assignment
Reel/Frame 056332/0061

Assignment of Assignor's Interest

Recorded: 2021-05-24 Pages: 5
Assignor
VENTECH, INC.
Executed: 2021-03-31
Assignee
API HEAT TRANSFER THERMASYS CORPORATION
2777 WALDEN AVENUE, BUFFALO, NEW YORK, 14225
Covered Property (1)
Channel Fin Heat Exchangers and Methods of Manufacturing the Same
Application: 16/158,470 →
Publication: US 2020/0116432
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 16, 2019
From: CHI, YEN-CHU
To: VENTI TECH INC.
Reel/Frame 051287/0375 →
Assignment of Assignor's Interest Jan 15, 2021
From: VENTI TECH, INC.
To: JENKINS, LANCE; CHI, YEN-CHU
Reel/Frame 055326/0611 →
Assignment of Assignor's Interest Feb 26, 2021
From: JENKINS, LANCE; CHI, YEN-CHU
To: VENTECH, INC.
Reel/Frame 055427/0692 →
Patent Security Agreement Nov 14, 2023
From: API HEAT TRANSFER THERMASYS CORPORATION; API HEAT TRANSFER INC.
To: ALTER DOMUS (US) LLC, AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 065564/0790 →