IP Library › Assignment 056350/0588
Patent Assignment
Reel/Frame 056350/0588

Assignment of Assignor's Interest

Recorded: 2021-05-24 Pages: 25
Assignors
FAY, OWEN R.
Executed: 2020-06-10
RICHARDS, RANDON K.
Executed: 2020-06-25
LIMAYE, APARNA U.
Executed: 2020-06-18
LIM, DONG SOON
Executed: 2020-07-07
YOO, CHAN H.
Executed: 2021-02-10
STREET, BRET K.
Executed: 2020-07-07
NAKANO, EIICHI
Executed: 2020-06-18
LUO, SHIJIAN
Executed: 2020-06-19
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Property (1)
Methods for Fabrication of Microelectronic Device Packages and Related Packages and Systems
Application: 63/037,902 →
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 27, 2020
From: FAY, OWEN R.; RICHARDS, RANDON K.; LIMAYE, APARNA U.; LIM, DONG SOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053323/0794 →
Assignment of Assignor's Interest May 25, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056346/0578 →