Patent Assignment
Reel/Frame 053323/0794
Assignment of Assignor's Interest
Recorded: 2020-07-27
Pages: 26
Assignors
FAY, OWEN R.
Executed: 2020-06-12
RICHARDS, RANDON K.
Executed: 2020-06-25
LIMAYE, APARNA U.
Executed: 2020-06-18
LIM, DONG SOON
Executed: 2020-07-07
YOO, CHAN H.
Executed: 2020-07-16
STREET, BRET K.
Executed: 2020-07-07
NAKANO, EIICHI
Executed: 2020-06-18
LUO, SHIJIAN
Executed: 2020-06-19
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Properties
(5)
Microelectronic Device Assemblies and Packages and Related Methods and Systems
Microelectronic Device Assemblies and Packages Including Multiple Device Stacks and Related Methods
Microelectronic Device Assemblies and Packages and Related Methods
Microelectronic Device Assemblies and Packages Including Surface Mount Components
Methods for Fabrication of Microelectronic Device Packages and Related Packages and Systems
Application:
63/037,902 →
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 27, 2020
From: FAY, OWEN R.; RICHARDS, RANDON K.; LIMAYE, APARNA U.; LIM, DONG SOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053320/0717 →
Assignment of Assignor's Interest
May 24, 2021
From: FAY, OWEN R.; RICHARDS, RANDON K.; LIMAYE, APARNA U.; LIM, DONG SOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056350/0588 →
Assignment of Assignor's Interest
May 25, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056346/0578 →
Assignment of Assignor's Interest
Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0841 →
Assignment of Assignor's Interest
Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0905 →
Assignment of Assignor's Interest
Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0734 →
Assignment of Assignor's Interest
Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0824 →