IP Library › Assignment 053320/0717
Patent Assignment
Reel/Frame 053320/0717

Assignment of Assignor's Interest

Recorded: 2020-07-27 Pages: 8
Assignors
FAY, OWEN R.
Executed: 2020-02-26
RICHARDS, RANDON K.
Executed: 2020-05-15
LIMAYE, APARNA U.
Executed: 2020-05-15
LIM, DONG SOON
Executed: 2020-05-15
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAILSTOP 1-507, BOISE, IDAHO, 83707-0006
Covered Properties (4)
Microelectronic Device Assemblies and Packages Including Multiple Device Stacks and Related Methods
Application: 16/939,650 →
Publication: US 2021/0118849
Microelectronic Device Assemblies and Packages and Related Methods
Application: 16/939,678 →
Publication: US 2021/0118850
Microelectronic Device Assemblies and Packages Including Surface Mount Components
Application: 16/939,720 →
Publication: US 2021/0118851
Microelectronic Device Assemblies and Packages and Related Methods and Systems
Application: 16/939,756 →
Publication: US 2021/0118852
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 27, 2020
From: FAY, OWEN R.; RICHARDS, RANDON K.; LIMAYE, APARNA U.; LIM, DONG SOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053323/0794 →
Assignment of Assignor's Interest Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0734 →
Assignment of Assignor's Interest Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0841 →
Assignment of Assignor's Interest Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0905 →
Assignment of Assignor's Interest Jun 11, 2021
From: LIMAYE, APARNA U.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 056514/0824 →