Patent Assignment
Reel/Frame 056514/0841
Assignment of Assignor's Interest
Recorded: 2021-06-11
Pages: 3
Assignor
LIMAYE, APARNA U.
Executed: 2021-05-24
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, MAIL STOP 1-507, BOISE, IDAHO, 83707
Covered Property
(1)
Microelectronic Device Assemblies and Packages Including Multiple Device Stacks and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 27, 2020
From: FAY, OWEN R.; RICHARDS, RANDON K.; LIMAYE, APARNA U.; LIM, DONG SOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053320/0717 →
Assignment of Assignor's Interest
Jul 27, 2020
From: FAY, OWEN R.; RICHARDS, RANDON K.; LIMAYE, APARNA U.; LIM, DONG SOON
To: MICRON TECHNOLOGY, INC.
Reel/Frame 053323/0794 →