Patent Assignment
Reel/Frame 056360/0404
Assignment of Assignor's Interest
Recorded: 2021-05-26
Pages: 8
Assignors
KWEON, JUNYUN
Executed: 2021-03-08
PARK, JUMYONG
Executed: 2021-03-11
OH, DONGJOON
Executed: 2021-03-11
JIN, JEONGGI
Executed: 2021-03-08
HWANG, HYUNSU
Executed: 2021-03-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interconnection Structure and Semiconductor Package Including the Same