Patent Assignment
Reel/Frame 056365/0150
Assignment of Assignor's Interest
Recorded: 2021-05-26
Pages: 4
Assignors
PAN, CHIH-CHIEN
Executed: 2021-05-11
WANG, PU
Executed: 2021-04-27
CHENG, LI-HUI
Executed: 2021-04-27
SU, AN-JHIH
Executed: 2021-04-27
LU, SZU-WEI
Executed: 2021-04-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Forming the Same