Patent Assignment
Reel/Frame 056380/0426
Assignment of Assignor's Interest
Recorded: 2021-05-28
Pages: 5
Assignors
MOON, HONGKI
Executed: 2021-04-01
PARK, YOONSUN
Executed: 2021-04-01
KANG, SEUNGHOON
Executed: 2021-04-01
KOO, KYUNGHA
Executed: 2021-04-01
JANG, SEYOUNG
Executed: 2021-04-01
JUNG, WOOJUNE
Executed: 2021-04-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Heat Dissipation Structure