Patent Assignment
Reel/Frame 056392/0447
Assignment of Assignor's Interest
Recorded: 2021-05-25
Pages: 3
Assignors
PYO, HYE SUNG
Executed: 2021-03-23
JUN, HO IN
Executed: 2021-03-23
JEON, KI HUN
Executed: 2021-03-23
HONG, DO HYUN
Executed: 2021-03-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component