Patent Assignment
Reel/Frame 056437/0123
Assignment of Assignor's Interest
Recorded: 2021-06-04
Pages: 4
Assignors
CHIANG, HSIN-CHIH
Executed: 2021-05-18
LIN, TUNG-YANG
Executed: 2021-05-21
LIU, RUEY-HSIN
Executed: 2021-05-18
LEI, MING-TA
Executed: 2021-06-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Breakdown Voltage Capability of High Voltage Device