Patent Assignment
Reel/Frame 056438/0604
Assignment of Assignor's Interest
Recorded: 2021-06-04
Pages: 4
Assignors
CHO, HUNG-CHUN
Executed: 2021-05-20
LIAO, SIH-HAO
Executed: 2021-05-30
HU, YU-HSIANG
Executed: 2021-05-20
KUO, HUNG-JUI
Executed: 2021-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Integrated Circuit Packages Having Adhesion Layers Over Through Vias