Patent Assignment
Reel/Frame 056452/0811
Assignment of Assignor's Interest
Recorded: 2021-06-07
Pages: 6
Assignors
YANG, KYOUNGSUK
Executed: 2021-04-27
LIM, SOYOUNG
Executed: 2021-04-27
CHUNG, YECHUNG
Executed: 2021-05-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package Substrate Film and Semiconductor Package Including the Same