Patent Assignment
Reel/Frame 056454/0221
Assignment of Assignor's Interest
Recorded: 2021-06-07
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2021-05-17
HSIA, HSING-KUO
Executed: 2021-05-08
TING, KUO-CHIANG
Executed: 2021-05-10
WU, JIUN YI
Executed: 2021-05-09
KUO, HUNG-YI
Executed: 2021-06-04
HOU, SHANG-YUN
Executed: 2021-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Photonic Package and Method of Manufacture