Patent Assignment
Reel/Frame 056454/0727
Assignment of Assignor's Interest
Recorded: 2021-06-07
Pages: 5
Assignors
CHIEN, WEI-YU
Executed: 2019-09-27
TSENG, CHIEN-HSIEN
Executed: 2019-09-27
YAUNG, DUN-NIAN
Executed: 2019-09-27
CHENG, NAI-WEN
Executed: 2019-09-27
CHEN, PAO-TUNG
Executed: 2019-09-27
CHU, YI-SHIN
Executed: 2019-10-23
SHEN, YU-YANG
Executed: 2019-09-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Packaging Device Comprising a Shield Structure