Patent Assignment
Reel/Frame 056456/0104
Assignment of Assignor's Interest
Recorded: 2021-06-07
Pages: 3
Assignor
MORITA, MINORU
Executed: 2021-04-15
Assignee
FURUKAWA ELECTRIC CO., LTD.
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8322, JAPAN
Covered Property
(1)
Adhesive Composition, Film-Like Adhesive and Production Method Thereof, and Semiconductor Package Using Film-Like Adhesive and Production Method Thereof