Patent Assignment
Reel/Frame 056461/0177
Assignment of Assignor's Interest
Recorded: 2021-06-08
Pages: 3
Assignors
HUNG, WENSEN
Executed: 2021-05-04
TSAI, YU-LING
Executed: 2021-05-04
CHIU, CHIEN-CHIA
Executed: 2021-05-19
CHEN, TSUNG-YU
Executed: 2021-05-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package with Stiffener Structure