Patent Assignment
Reel/Frame 056463/0347
Assignment of Assignor's Interest
Recorded: 2021-06-08
Pages: 4
Assignor
CHOI, DONGJOO
Executed: 2021-06-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips and Semiconductor Packages Including the Same