Patent Assignment
Reel/Frame 056470/0323
Assignment of Assignor's Interest
Recorded: 2021-06-08
Pages: 2
Assignor
KURIHARA, HIROYUKI
Executed: 2021-06-08
Assignee
SAN-EI KAGAKU CO., LTD.
31-16, HORIFUNE 1-CHOME, KITA-KU, TOKYO, 114-0004, JAPAN
Covered Property
(1)
Via Wiring Formation Substrate, Manufacturing Method for via Wiring Formation Substrate, and Semiconductor Device Mounting Component