Patent Assignment
Reel/Frame 056486/0367
Assignment of Assignor's Interest
Recorded: 2021-06-09
Pages: 3
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Region-of-Interest Positioning for Laser-Assisted Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.