Patent Assignment
Reel/Frame 056492/0154
Assignment of Assignor's Interest
Recorded: 2021-06-09
Pages: 4
Assignor
SEYAMA, KOHEI
Executed: 2021-06-09
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device, and Mounting Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.