Patent Assignment
Reel/Frame 056502/0631
Assignment of Assignor's Interest
Recorded: 2021-06-10
Pages: 12
Assignors
THEN, HAN WUI
Executed: 2021-06-01
ELSHERBINI, ADEL A.
Executed: 2021-06-03
JUN, KIMIN
Executed: 2021-05-26
SWAN, JOHANNA M.
Executed: 2021-05-24
LIFF, SHAWNA M.
Executed: 2021-05-24
TIAGARAJ, SATHYA NARASIMMAN
Executed: 2021-05-24
PASDAST, GERALD S.
Executed: 2021-06-08
ALEKSOV, ALEKSANDAR
Executed: 2021-05-24
EID, FERAS
Executed: 2021-06-02
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Active Device Layer at Interconnect Interfaces
Application:
17/344,348 →
Publication:
US 2022/0399324