Patent Assignment
Reel/Frame 056533/0929
Assignment of Assignor's Interest
Recorded: 2021-06-14
Pages: 4
Assignors
SIO, KAM-TOU
Executed: 2021-03-30
CHUANG, CHENG-CHI
Executed: 2021-03-30
WU, CHIA-TIEN
Executed: 2021-03-30
TZENG, JIANN-TYNG
Executed: 2021-04-11
PENG, SHIH-WEI
Executed: 2021-03-30
LIN, WEI-CHENG
Executed: 2021-03-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices with Backside Power Distribution Network and Frontside Through Silicon Via