Patent Assignment
Reel/Frame 056535/0920
Assignment of Assignor's Interest
Recorded: 2021-06-14
Pages: 4
Assignors
JANG, JUNGHWAN
Executed: 2021-06-11
NAM, GIWOONG
Executed: 2021-06-11
KANG, MYONGSUK
Executed: 2021-06-14
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Vertical Interconnect Structure for POP Module
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.