Patent Assignment
Reel/Frame 056547/0001
Assignment of Assignor's Interest
Recorded: 2021-06-15
Pages: 4
Assignors
ZHAN, KAI JUN
Executed: 2021-06-11
KAO, CHIN-FU
Executed: 2021-05-25
LEE, KUANG-CHUN
Executed: 2021-05-25
CHENG, MING-DA
Executed: 2021-05-25
CHEN, CHEN-SHIEN
Executed: 2021-05-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Methods of Manufacture