Patent Assignment
Reel/Frame 056549/0714
Assignment of Assignor's Interest
Recorded: 2021-06-15
Pages: 8
Assignors
CHANG, GEORGE
Executed: 2018-09-21
LIN, YUSHENG
Executed: 2018-10-04
GRIVNA, GORDON M.
Executed: 2018-09-25
NOMA, TAKASHI
Executed: 2018-09-25
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Fan-Out Wafer Level Packaging of Semiconductor Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 2, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 057054/0706 →
Release of Security Interest in Patents Recorded at Reel 057054, Frame 0706
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064083/0001 →