Patent Assignment
Reel/Frame 057054/0706
SECURITY INTEREST
Recorded: 2021-08-02
Received: 2021-08-02
Pages: 10
Assignors
FAIRCHILD SEMICONDUCTOR CORPORATION
Executed: 2021-07-28
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Executed: 2021-07-28
Assignee
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
60 WALL STREET, NEW YORK, NY, 10005, UNITED STATES
Covered Applications
(37)
SEMICONDUCTOR PACKAGES AND RELATED METHODS
App. No. 17/304,792
→
VOLTAGE REFERENCE WITH TEMPERATURE-SELECTIVE SECOND-ORDER TEMPERATURE COMPENSATION
App. No. 17/304,769
→
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
App. No. 17/304,715
→
DIAGNOSTIC FUNCTION OF SHORT-CIRCUIT PROTECTION
App. No. 63/212,222
→
INTEGRATED RESISTOR DIODE CAPACITOR SNUBBER
App. No. 63/202,619
→
DIFFERENTIAL OPERATIONAL TRANSCONDUCTANCE AMPLIFIER FOR CHOPPER-STABILIZED AMPLIFICATION
App. No. 17/304,132
→
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
App. No. 17/304,136
→
HIGH LINEARITY LOW CLAMPING VOLTAGE EMI FILTER AND ESD PROTECTION DEVICE
App. No. 63/202,462
→
SEMICONDUCTOR PACKAGE STRUCTURE AND RELATED METHODS
App. No. 17/344,082
→
ZVS BASED FREQUENCY MODULATION FOR ACTIVE CLAMP FLYBACK TOPOLOGY
App. No. 63/202,304
→
AMPLIFIERS SUITABLE FOR MM-WAVE SIGNAL SPLITTING AND COMBINING
App. No. 17/338,526
→
RECONFIGURABLE MIMO RADAR
App. No. 17/338,407
→
CLIENT STEERING FOR A WIRELESS LOCAL AREA NETWORK
App. No. 17/336,053
→
DATA COMMUNICATION SYSTEM AND METHOD
App. No. 63/189,581
→
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
App. No. 17/320,582
→
SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS
App. No. 17/320,495
→
UPLINK ERROR RATE
App. No. 17/320,068
→
SEMICONDUCTOR DEVICES WITH SINGLE-PHOTON AVALANCHE DIODES AND ISOLATION STRUCTURES
App. No. 17/302,836
→
RECEIVE PATH IN-PHASE AND QUADRATURE IMBALANCE CORRECTION USING CIRCUIT NOISE
App. No. 17/317,137
→
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
App. No. 17/315,671
→
SEMICONDUCTOR PACKAGE AND RELATED METHODS
App. No. 17/316,367
→
SEMICONDUCTOR DEVICE ASSEMBLY AND A METHOD OF MANUFACTURING SUCH A DEVICE ASSEMBLY
App. No. 63/184,386
→
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
App. No. 17/306,396
→
PREVENTING OUTPUT OVERVOLTAGE IN A TOTEM POLE PFC
App. No. 63/180,506
→
CURRENT MODE CONTROL FOR MULTISTAGE INTERLEAVE RESONANT CONVERTER
App. No. 63/180,503
→
GATE DRIVER WITH THERMAL MONITORING AND CURRENT SENSING
App. No. 63/180,488
→
METHODS AND APPARATUS FOR A POWER SUPPLY CONTROL CIRCUIT
App. No. 17/302,119
→
RETRANSMISSION OF WIRELESS DATA
App. No. 17/237,510
→
WIRELESS COMMUNICATION USING MULTIPLE FREQUENCIES SEGMENTS
App. No. 17/237,421
→
SPATIAL REUSE IN WIRELESS COMMUNICATION
App. No. 17/237,469
→
WIRELESS COMMUNICATION WITH CODED DATA FRAMES
App. No. 17/237,383
→
SEMICONDUCTOR DEVICES AND METHODS
App. No. 63/174,429
→
INDUCTIVE ECCENTRICITY & TILT SENSOR
App. No. 63/201,038
→
DIODE DRIVER, LIDAR SYSTEM AND A METHOD OF OPERATING
App. No. 63/171,445
→
CURRENT LIMITING CIRCUIT
App. No. 63/171,453
→
CURRENT BALANCING FOR INTERLEAVED POWER CONVERTERS
App. No. 17/301,393
→
ASSEMBLY PROCESSES FOR SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING SPACER WITH EMBEDDED SEMICONDUCTOR DIE
App. No. 17/220,661
→