Patent Assignment
Reel/Frame 056550/0519
Assignment of Assignor's Interest
Recorded: 2021-06-15
Pages: 3
Assignor
SAKUMA, KATSUYUKI
Executed: 2021-06-09
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Solder Transfer Integrated Circuit Packaging