Patent Assignment
Reel/Frame 056552/0208
Assignment of Assignor's Interest
Recorded: 2021-06-15
Pages: 3
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2021-03-30
HUANG, WEN-TUO
Executed: 2021-03-31
WU, WEI-CHENG
Executed: 2021-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Bonded Wafer Device Structure and Methods for Making the Same