Patent Assignment
Reel/Frame 056554/0742
Assignment of Assignor's Interest
Recorded: 2021-06-15
Pages: 6
Assignors
KIM, TAEHONG
Executed: 2021-05-28
KIM, YOUNGHOO
Executed: 2021-05-31
PARK, SUNGHYUN
Executed: 2021-05-31
LEE, KUNTACK
Executed: 2021-05-31
Assignee
SAMSUNG ELECTRONICS CO, LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Heating Apparatus and Method for Processing a Substrate