Patent Assignment
Reel/Frame 056559/0290
Assignment of Assignor's Interest
Recorded: 2021-06-16
Pages: 4
Assignors
CHANG, PO-CHIN
Executed: 2021-04-28
TSAI, MING-HUAN
Executed: 2021-04-22
LIN, LI-TE
Executed: 2021-04-26
LIN, PINYEN
Executed: 2021-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Capping Structures in Semiconductor Devices