Patent Assignment
Reel/Frame 056574/0087
Assignment of Assignor's Interest
Recorded: 2021-06-17
Pages: 3
Assignors
LEE, KUN-YU
Executed: 2021-06-06
WANG, CHUNYAO
Executed: 2021-06-06
CHUI, CHI ON
Executed: 2021-06-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Semiconductor Device with Fin Structures