Patent Assignment
Reel/Frame 056574/0752
Assignment of Assignor's Interest
Recorded: 2021-06-17
Pages: 6
Assignors
KIM, JI HWANG
Executed: 2021-05-26
KIM, DONGHO
Executed: 2021-05-26
PARK, JIN-WOO
Executed: 2021-05-26
SHIM, JONGBO
Executed: 2021-05-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same