Patent Assignment
Reel/Frame 056583/0857
Assignment of Assignor's Interest
Recorded: 2021-06-18
Pages: 14
Assignors
FUKUNAGA, NOBUTAKA
Executed: 2021-06-01
YARIMITSU, MASAKAZU
Executed: 2021-05-24
FUJII, KATSUHISA
Executed: 2021-06-14
RYU, HIDEJIRO
Executed: 2021-05-24
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method