Patent Assignment
Reel/Frame 056584/0883
Assignment of Assignor's Interest
Recorded: 2021-06-18
Pages: 5
Assignors
ONO, KENTA
Executed: 2021-06-17
ISHIKAWA, SHINYA
Executed: 2021-06-15
HONDA, MASANOBU
Executed: 2021-06-15
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Etching Method, Substrate Processing Apparatus, and Substrate Processing System