IP Library › Assignment 056593/0955
Patent Assignment
Reel/Frame 056593/0955

Assignment of Assignor's Interest

Recorded: 2021-06-19 Pages: 16
Assignors
ZENG, FEI
Executed: 2021-02-09
WANG, JIALIN
Executed: 2021-02-08
DENG, JIA
Executed: 2021-02-09
QIN, CHAOXUE
Executed: 2021-02-09
LIANG, HAITAO
Executed: 2021-02-09
LIN, ZHIBING
Executed: 2021-02-09
ZHOU, GUODONG
Executed: 2021-02-09
Assignees
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
NO. 1188 HEZUO RD., (WEST ZONE) HI-TECH DEVELOPMENT ZONE, CHENGDU, 611731, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property (1)
Bonding Device and Bonding Method
Application: 17/352,275 →
Publication: US 2022/0024196
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 29, 2022
From: BOE TECHNOLOGY GROUP CO., LTD.
To: BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Reel/Frame 060666/0124 →