Patent Assignment
Reel/Frame 056603/0029
Assignment of Assignor's Interest
Recorded: 2021-06-21
Pages: 10
Assignors
SHIN, INSUP
Executed: 2021-01-26
KANG, HYEONGMUN
Executed: 2021-01-26
KO, JUNGMIN
Executed: 2021-06-04
CHOI, HWANYOUNG
Executed: 2021-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Chip-Stacked Semiconductor Package with Increased Package Reliability