Patent Assignment
Reel/Frame 056603/0153
Assignment of Assignor's Interest
Recorded: 2021-06-21
Pages: 3
Assignor
LIN, HSIANG-WEI
Executed: 2021-06-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method for Forming the Same