Patent Assignment
Reel/Frame 056603/0741
Assignment of Assignor's Interest
Recorded: 2021-06-16
Pages: 2
Assignee
SILTRONIC AG
EINSTEINSTR. 172, MUNICH, 81677, GERMANY
Covered Property
(1)
Method for Producing Semiconductor Wafers Using a Wire Saw, Wire Saw, and Semiconductor Wafers Made of Monocrystalline Silicon