Patent Assignment
Reel/Frame 056625/0888
Assignment of Assignor's Interest
Recorded: 2021-06-22
Pages: 4
Assignor
LIU, CHUNJIAN
Executed: 2021-05-14
Assignees
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
XINZHAN INDUSTRIAL PARK, HEFEI, ANHUI, 230012, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Light Emitting Substrate, Light Emitting Motherboard, Method for Obtaining Light Emitting Substrate, and Displaying Device
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2021
From: LEI, JIE
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056625/0833 →
Assignment of Assignor's Interest
Jun 22, 2021
From: XU, ZOUMING
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056625/0858 →
Assignment of Assignor's Interest
Jun 22, 2021
From: TIAN, JIAN
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056625/0862 →
Assignment of Assignor's Interest
Jun 22, 2021
From: WU, XINTAO
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056625/0907 →
Assignment of Assignor's Interest
Jun 22, 2021
From: WANG, JIE
To: HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 056625/0911 →